OR3C55 查看數據表（PDF） - Agere -> LSI Corporation

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OR3C55

ORCA® Series 3C and 3T Field-Programmable Gate Arrays

Agere -> LSI Corporation 

Data Sheet

June 1999

ORCA Series 3C and 3T FPGAs

Package Outline Diagrams (continued)

240-Pin SQFP2

Dimensions are in millimeters.

34.60 ± 0.20

32.00 ± 0.20

24. 2 REF

240

PIN #1 IDENTI FIER ZONE

1

60

1.30 REF

181

180

0.25

GAGE PLANE

SEATING PLANE

24 .2

RE F

32.00

± 0.20

34.60

± 0.20

DETAIL A

0.50/0.75

0.090/0.200

0.17/0.27

0.10 M

DETAIL B

121

61

120

EXPOSED HEAT SINK APPEARS ON BOTTOM

SURFACE: CHIP BONDED FACE UP. (SEE DETAIL C.)

DETAIL A

0.50 TYP

DETAIL B

3.40 ± 0.20

0.25 MIN

CHIP BONDED FACE UP

4.10 MAX

SEATING PLANE

0.08

CHIP

COPPER HEAT SINK

DETAIL C (SQFP2 CHIP-UP)

Lucent Technologies Inc.

5-3825(F).a

201

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