OR3C55-4S240 查看數據表（PDF） - Agere -> LSI Corporation

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OR3C55-4S240

ORCA® Series 3C and 3T Field-Programmable Gate Arrays

Agere -> LSI Corporation 

ORCA Series 3C and 3T FPGAs

Package Outline Diagrams (continued)

256-Pin PBGA

Dimensions are in millimeters.

A1 BALL

IDENTIFIER ZONE

27.00 ± 0.20

+0.70

24.00 –0.00

Data Sheet

June 1999

+0.70

24.00 –0.00

27.00

± 0.20

MOLD

COMPOUND

PWB

0.36 ± 0.04

1.17 ± 0.05

0.60 ± 0.10

SOLDER BALL

19 SPACES @ 1.27 = 24.13

2.13 ± 0.19

SEATING PLANE

0.20

Y

W

V

U

T

R

P

N

M

L

K

J

H

G

F

CENTER ARRAY

FOR THERMAL

ENHANCEMENT

(OPTIONAL)

E

D

C

(SEE NOTE BELOW) B

A

A1 BALL

CORNER

1 2 3 4 5 6 7 8 9 10 12 14 16 18 20

11 13 15 17 19

0.75 ± 0.15

19 SPACES

@ 1.27 = 24.13

Note: Although the 16 thermal enhancement balls are stated as an option, they are standard on the 256 FPGA package.

5-4406(F)

202

Lucent Technologies Inc.

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