OR3C55-4S208 查看數據表（PDF） - Agere -> LSI Corporation

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OR3C55-4S208

ORCA® Series 3C and 3T Field-Programmable Gate Arrays

Agere -> LSI Corporation 

Data Sheet

June 1999

Package Outline Diagrams (continued)

352-Pin PBGA

Dimensions are in millimeters.

A1 BALL

IDENTIFIER ZONE

35.00 ± 0.20

30.00

+0.70

–0.00

ORCA Series 3C and 3T FPGAs

30.00

+0.70

–0.00

35.00

± 0.20

MOLD

COMPOUND

PWB

0.56 ± 0.06

1.17 ± 0.05

0.60 ± 0.10

SOLDER BALL

25 SPACES @ 1.27 = 31.75

2.33 ± 0.21

SEATING PLANE

0.20

AF

AE

AD

AC

AB

AA

Y

W

V

U

T

R

P

N

M

L

K

J

CENTER ARRAY

FOR THERMAL

H

G

F

ENHANCEMENT E

(OPTIONAL) D

(SEE NOTE BELOW)

C

B

A

A1 BALL

CORNER

1 2 3 4 5 6 7 8 9 10 12 14 16 18 20 22 24 26

11 13 15 17 19 21 23 25

0.75 ± 0.15

25 SPACES

@ 1.27 = 31.75

Note: Although the 36 thermal enhancement balls are stated as an option, they are standard on the 352 FPGA package.

5-4407(F)

Lucent Technologies Inc.

203

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