MBRD1045 查看數據表（PDF） - ON Semiconductor
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MBRD1045 Datasheet PDF : 6 Pages
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MBRB1045, MBRD1045
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance,
(MBRB1045) − Junction−to−Case (Note 2)
− Junction−to−Ambient (Note 2)
(MBRD1045) − Junction−to−Case (Note 2)
− Junction−to−Ambient (Note 2)
2. When mounted using minimum recommended pad size on FR−4 board.
ELECTRICAL CHARACTERISTICS
Characteristic
Maximum Instantaneous Forward Voltage (Note 3)
(IF = 10 Amps, TJ = 125°C)
(IF = 20 Amps, TJ = 125°C)
(IF = 20 Amps, TJ = 25°C)
Maximum Instantaneous Reverse Current (Note 3)
(Rated dc Voltage, TJ = 125°C)
(Rated dc Voltage, TJ = 25°C)
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%
Symbol
RqJC
RqJA
RqJC
RqJA
Symbol
VF
IR
Value
1.0
50
2.43
68
Unit
°C/W
Value
Unit
V
0.57
0.72
0.84
mA
15
0.1
ORDERING INFORMATION
Device
MBRB1045
MBRB1045G
Package
D2PAK
D2PAK
(Pb−Free)
Shipping†
50 Units / Rail
50 Units / Rail
MBRB1045T4
MBRB1045T4G
D2PAK
D2PAK
(Pb−Free)
800 Units / Tape & Reel
800 Units / Tape & Reel
MBRD1045T4G
DPAK
(Pb−Free)
2500 Units / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
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