MAX9730 查看數據表（PDF） - Maxim Integrated
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MAX9730 Datasheet PDF : 15 Pages
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2.4W, Single-Supply, Class G Power Amplifier
Thermal Considerations
Class G amplifiers provide much better efficiency and
thermal performance than a comparable Class AB
amplifier. However, the system’s thermal performance
must be considered with realistic expectations and
include consideration of many parameters. This section
examines Class G amplifiers using general examples to
illustrate good design practices.
TQFN Considerations
The exposed pad is the primary route of keeping heat
away from the IC. With a bottom-side exposed pad, the
PCB and its copper become the primary heatsink for
the Class G amplifier. Solder the exposed pad to a
large copper polygon that is connected to the ground
plane.
The copper polygon to which the exposed pad is
attached should have multiple vias to the opposite side
of the PCB, where they connect to GND. Make this
polygon as large as possible within the system’s con-
straints.
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, PCB techniques,
bump-pad layout, and recommended reflow tempera-
ture profile, as well as the latest information on reliability
testing results, go to the Maxim website at www.maxim-
ic.com/ucsp for the application note, UCSP—A Wafer-
Level Chip-Scale Package.
Typical Application Circuit/Functional Diagram
VDD
0.1μF
*
14, 22
1 (B2) (D1, D5) 4 (A3)
SHDN VCC CPVDD
12 (B4) FB+
MAX9730
CIN
1μF
RIN-
10kΩ
RFB+
10kΩ
10 (B5) IN+
+
CLASS G
9 (A5) IN-
-
OUTPUT
STAGE
OUT+ 20 (D2)
OUT- 16 (D4)
CIN
1μF
RIN-
10kΩ
RFB-
10kΩ
CHARGE
FS 13 (C5)
7 (A4) FB-
PUMP
GND CPGND C1N
C1P PVSS
SVSS
RFS
100kΩ
18 (D3) 27 (A1) 26 (B1)
3 (A2) 24 (C1) 15, 21
(C2, C4)
( ) UCSP PACKAGE
C1
C2
4.7μF
10μF
DEVICE SHOWN WITH AV = 12dB
*SYSTEM-LEVEL REQUIREMENT TYPICALLY 10μF
10 ______________________________________________________________________________________
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