Package Mechanical Data
4 Package Mechanical Data
4.1 Pin-out and markings for 9-bump flip-chip
Figure 61. Pin-out for 9-bump flip-chip (top view)
IN+
1/A1
VDD
4/B1
IN-
7/C1
GND
2/A2
VDD
5/B2
STBY
8/C2
OUT-
3/A3
GND
6/B3
OUT+
9/C3
■ Bumps are underneath
■ Bump diameter = 300µm
Figure 62. Marking for 9-bump flip-chip (top view)
E
A62
YWW
Marking: A62
■ ST Logo
■ Part Number: A62
■ Three digits Datecode: YWW
■ E symbol for lead-free only
■ The dot is for marking pin A1
TS4962
4.2 Mechanical data for 9-bump flip-chip
1.60 mm
0.5mm
1.60 mm
■ Die size: 1.6mm x 1.6mm ±30µm
■ Die height (including bumps): 600µm
■ Bump diameter: 315µm ±50µm
■ Bump diameter before Reflew: 300µm ±10µm
■ Bump height: 250µm ±40µm
■ Die Height: 350µm ±20µm
■ Pitch: 500µm ±50µm
■ *Back Coating layer Height: 100µm ±10µm
■ Coplanarity: 60µm max
0.5mm
∅ 0.25mm
* Optional
100µm
600µm
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