HSDL-3209 查看數據表（PDF） - LiteOn Technology
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HSDL-3209 Datasheet PDF : 16 Pages
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Moisture Proof Packaging
All HSDL-3209 options are shipped in moisture proof
package. Once opened, moisture absorption begins. This
part is compliant to JEDEC Level 3.
Units in A Sealed
Mositure-Proof
Package
Package Is
Opened (Unsealed)
No Baking
Is Necessary
Environment
less than 30 deg C, and
less than 60% RH ?
Yes
Yes
Package Is
Opened less
than 168 hours ?
No
No
Perform Recommended
Baking Conditions
Baking Conditions:
If the parts are not stored in dry conditions, they must be
baked before reflow to prevent damage to the parts.
Baking should only be done once.
Package
In Reel
In Bulk
Temperature
60°C
100°C
Time
≥ 48 hours
≥ 4 hours
Recommended Storage Conditions:
Before MBB Unsealed
Storage Temperature
Storage TemperatureStorage Temperature
Relative Humidity
10°C to 30°C
below 60% RH
Time from unsealing to soldering:
After removal from the bag, the parts should be soldered
within 168 hours if stored at the recommended storage
conditions.
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