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HSP061-4M10Y 查看數據表(PDF) - STMicroelectronics

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HSP061-4M10Y Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
Characteristics
1
Characteristics
Figure 1. Functional schematic (top view)
I/O 1 1
I/O 2 2
GND 3
I/O 3 4
I/O 4 5
Internally
10 not connected
9
8 GND
7
Internally
6 not connected
HSP061-4M10Y
Symbol
Table 1. Absolute maximum ratings Tamb = 25 °C
Parameter
Value
Unit
ISO 10605: C = 150 pF, R = 330
contact discharge
8
air discharge
15
VPP
Peak pulse voltage
ISO 10605: C = 330 pF, R = 330
kV
contact discharge
8
air discharge
15
Tj
Operating junction temperature range
Tstg Storage temperature range
TL Maximum lead temperature for soldering during 10 s
-40 to +150
°C
-65 to +150
°C
260
°C
Symbol
Table 2. Electrical characteristics Tamb = 25 °C
Parameter
Test conditions
Min. Typ. Max. Unit
VBR Breakdown voltage
IRM Leakage current
VCL Clamping voltage
Capacitance
CI/O - I/O (I/O to I/O)
Capacitance
CI/O - GND (I/O to GND)
fC Cut-off frequency
ZDiff
Differential
impedance
IR = 1 mA
VRM = 3 V
IPP = 1 A, 8/20 µs
VI/O = 0 V, F = 1 MHz, VOSC = 30 mV
6
V
70 nA
15 V
0.3 0.4 pF
VI/O = 0 V F = 1 MHz, VOSC = 30 mV
0.6 0.8 pF
-3dB
8.7
GHz
tr = 200 ps (10 - 90%)(1), Z0 Diff = 100 85 100 115
1. HDMI specification conditions. This information can be provided for other applications. Please contact your
local ST office.
2/11
DocID025560 Rev 1

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