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HSP061-4M10Y 查看數據表(PDF) - STMicroelectronics
零件编号
产品描述 (功能)
生产厂家
HSP061-4M10Y
Automotive 4-line ESD protection for high speed lines
STMicroelectronics
HSP061-4M10Y Datasheet PDF : 11 Pages
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HSP061-4M10Y
Recommendation on PCB assembly
3.4
Reflow profile
Figure 16. ST ECOPACK
®
recommended soldering reflow profile for PCB mounting
Temperature (°C)
250
200
150
100
0.9 °C/s
50
0
30
60
90
240-245 °C
2 - 3 °C/s
60 sec
(90 max)
-2 °C/s
-3 °C/s
-6 °C/s
Time (s)
120 150 180 210 240 270 300
Note:
Minimize air convection currents in the reflow oven to avoid component movement.
Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020.
DocID025560 Rev 1
9/11
11
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