B72735D0050H062(2007) 查看數據表（PDF） - EPCOS AG
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B72735D0050H062 Datasheet PDF : 10 Pages
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CeraDiode
SMD type, array, case size 1012
B72735D0050H062
CDA6C05GTH
Recommended infrared reflow soldering temperature profile
Tp
TL
T Smax
tp
Ramp-up
Critical zone
TL to Tp
tL
T Smin
tS Preheat
Ramp-down
25
t 25 ˚C to peak
Time
TPT0892-3-E
Profile feature
Average ramp-up rate (TSmax to
Tp)
Preheat
- Temperature min (TSmin)
- Temperature max (TSmax)
- Time (tSmin to tSmax)
Time maintained above
- Temperature min (TL)
- Time (tL)
Peak classification temperature
(Tp)
Time within 5 °C of actual peak
temperature (tp)
Ramp-down rate
Time 25 °C to peak temperature
Sn-Pb eutectic assembly
3 °C/ second max.
100 °C
150 °C
60 … 120 seconds
183 °C
60 … 150 seconds
220 °C … 240 °C
10 … 30 seconds
6 °C/ second max.
6 minutes max.
Pb-free assembly
3 °C/ second max.
150 °C
200 °C
60 … 180 seconds
217 °C
60 … 150 seconds
240 °C … 260 °C
20 … 40 seconds
6 °C/ second max.
8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Soldering guidelines
The usage of mild, non-activated fluxes for soldering is recommended, as well as proper cleaning of
the PCB.
The components are suitable for reflow soldering to JEDEC J-STD-020C.
Please read Important notes at
the end of this document.
Page 7 of 10
2007-02-20
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