ISL6422 查看數據表（PDF） - Renesas Electronics
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ISL6422 Datasheet PDF : 20 Pages
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ISL6422
Thin Shrink Small Outline Exposed Pad Plastic Packages (EPTSSOP)
N
INDEX
AREA
E
E1
-B-
0.25(0.010) M B M
GAUGE
PLANE
123
TOP VIEW
0.05(0.002) SEATING PLANE
L
0.25
0.010
-A-
D
A
-C-
A2
c
e
A1
b
0.10(0.004)
0.10(0.004) M C A M B S
123
P1
N
P
BOTTOM VIEW
M38.173B
38 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
-
0.047
-
1.20
-
A1
0.002 0.006
0.05
0.15
-
A2
0.031 0.051
0.80
1.05
-
b
0.0075 0.0106 0.17
0.27
9
c
0.0035 0.0079 0.09
0.20
-
D
0.378 0.386
9.60
9.80
3
E1
0.169 0.177
4.30
4.50
4
e
0.0197 BSC
0.500 BSC
-
E
0.246 0.256
6.25
6.50
-
L
0.0177 0.0295 0.45
0.75
6
N
38
38
7
0o
8o
0o
8o
-
P
-
0.256
-
6.5
11
P1
-
0.126
-
3.2
11
NOTES:
Rev. 0 9/06
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-BD-1, Issue F.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.15mm (0.006
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum
space between protrusion and adjacent lead is 0.07mm (0.0027
inch).
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact. (Angles in degrees)
11. Dimensions “P” and “P1” are thermal and/or electrical enhanced
variations. Values shown are maximum size of exposed pad
within lead count and body size.
FN9190 Rev 2.00
Aug 10, 2007
Page 20 of 20
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