80960SB 查看數據表（PDF） - Intel

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80960SB

EMBEDDED 32-BIT MICROPROCESSOR WITH 16-BIT BURST DATA BUS

Intel 

80960SB

The sections significantly changed between revisions -003 and -004 of the 80960SA/SB Data Sheet were:

Section

Last

Rev.

Description

DC Characteristics

-003

Operating temperature for PLCC package changed:

WAS:

TCASE = 0°C to +100°C

IS:

TCASE = 0°C to +85°C

The test program has not changed.

Table 7. QFP Package, Thermal Resis-

tance — °C/Watt

-003

Corrected QFP Package Thermal Resistance values:

for θJA at 0 ft./min.

airflow:

for θJC at 0 ft./min.

airflow:

WAS: 45.7° /W

WAS: 4° /W

IS:

54° /W

IS:

11° /W

Table 8. PLCC Package, Thermal Resis-

tance — °C/Watt

-003

Corrected PLCC Package Thermal Resistance val-

ues:

for θJA:

at 50 ft./min. airflow

at 100 ft./min. airflow

WAS:

NA

WAS:

NA

IS:

31

IS:

28.5

for θJC:

at 0 ft./min. airflow

at 50–1000 ft./min. airflow

WAS:

13

WAS:

NA

IS:

11

IS:

11

Table 9. 80960SA and 80960SB QFP

Pinout — In Pin Order

-003

Signal A12 incorrectly shown as Pin 28; is now cor-

rectly shown as Pin 38. Note added to clarify No Con-

nect Pins.

34

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