MCF5271CVM100 查看數據表（PDF） - Freescale Semiconductor

零件编号

产品描述 (功能)

生产厂家

MCF5271CVM100

Integrated Microprocessor Hardware Specification

Freescale Semiconductor 

Mechanicals/Pinouts and Part Numbers

6.2 Package Dimensions—196 MAPBGA

Figure 4 shows MCF5270/71CVMxxx package dimensions.

X

D

Y

Laser mark for pin 1

identification in

this area

NOTES:

1. Dimensions are in millimeters.

2. Interpret dimensions and tolerances

per ASME Y14.5M, 1994.

M

3. Dimension b is measured at the

maximum solder ball diameter,

K

parallel to datum plane Z.

4. Datum Z (seating plane) is defined

by the spherical crowns of the solder

balls.

5. Parallelism measurement shall

exclude any effect of mark on top

surface of package.

E

TOL

14 13 12 11 10 9

13X e

S

654 32 1

S

13X e

3

196X

b

0.15 Z X Y

0.08 Z

View M-M

Millimeters

DIM

Min

Max

A

1.25

1.60

A1 0.27

0.47

A2

1.16 REF

M

b

0.45

0.55

D

15.00 BSC

E

15.00 BSC

Metalized mark for

pin 1 identification

in this area

e

1.00 BSC

S

0.50 BSC

A

B

C

D

5

E

F

A A2

G

0.20 Z

H

J

K

A1

Z4

0.10 Z

196X

L

Detail K

M

Rotated 90° Clockwise

N

P

Figure 4. 196 MAPBGA Package Dimensions (Case No. 1128A-01)

MCF5271 Integrated Microprocessor Hardware Specification, Rev. 4

14

Freescale Semiconductor

Share Link: