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MPX4100AS 查看數據表(PDF) - Motorola => Freescale

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MPX4100AS Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
FLUORO SILICONE
GEL DIE COAT
WIRE BOND
LEAD
FRAME
DIE
P1
STAINLESS
STEEL CAP
THERMOPLASTIC
CASE
1.0 mF
MPX4100A MPXA4100A SERIES
+5 V
0.01 mF
Vout
Vs
IPS
GND
OUTPUT
470 pF
ABSOLUTE ELEMENT
SEALED VACUUM REFERENCE
DIE BOND
Figure 2. Cross Sectional Diagram SOP
(not to scale)
Figure 2 illustrates the absolute sensing chip in the basic
chip carrier (Case 482).
Figure 3. Recommended power supply decoupling
and output filtering.
For additional output filtering, please refer to
Application Note AN1646.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D in-
put of a microprocessor or microcontroller. Proper decoup-
ling of the power supply is recommended.
5.0
4.5 TRANSFER FUNCTION:
MAX
4.0
Vout = Vs* (.01059*P-.152) ± Error
VS = 5.1 Vdc
3.5 TEMP = 0 to 85°C
TYP
3.0
20 kPa TO 105 kPa
MPX4100A
2.5
2.0
1.5
1.0
MIN
0.5
0
Pressure (ref: to sealed vacuum) in kPa
Figure 4. Output versus Absolute Pressure
Figure 4 shows the sensor output signal relative to pres-
sure input. Typical, minimum, and maximum output curves
are shown for operation over a temperature range of 0° to
85°C. The output will saturate outside of the specified pres-
sure range.
A fluorosilicone gel isolates the die surface and wire
bonds from the environment, while allowing the pressure
signal to be transmitted to the sensor diaphragm. The
MPX4100A/MPXA4100A series pressure sensor operat-
ing characteristics, and internal reliability and qualification
tests are based on use of dry air as the pressure media.
Media, other than dry air, may have adverse effects on
sensor performance and long–term reliability. Contact the
factory for information regarding media compatibility in
your application.
Motorola Sensor Device Data
3

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