VSC852(2000) 查看數據表（PDF） - Vitesse Semiconductor
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VSC852 Datasheet PDF : 16 Pages
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VITESSE
SEMICONDUCTOR CORPORATION
Data Sheet
VSC852
Package Information
35mm 440 BGA Package Drawing
BOTTOM VIEW
10
26 24 22 20 18 16 14 12 10 8 6 4 2
27 25 23 21 19 17 15 13 11 9 7 5 3 1
A
B
J
C
D
E
F
G
H
J
K
L
P
M
N
P
R
T
U
5
V
W
Y
AA
AB
AC
AD
AE
AF
AG
11
e
CORNER
D1
1.6Gb/s 64x64
Crosspoint Switch
c A1
aaa C
A
/ / ccc C
-C-
6
0.10
D
-A-
-B-
E
b
00.30 S C A S B S
00.10 S C
4
DIMENSIONAL REFERENCES
REF.
MIN.
NOM.
A
1.65
1.80
A1
0.60
0.65
D
34.80
35.00
D1
33.02 (BSC.)
MAX.
1.95
0.70
35.20
E
34.80
35.00
35.20
E1
33.02 (BSC.)
b
0.65
0.75
0.85
c
1.05
1.15
1.25
M
27
N
440
aaa
0.15
ccc
0.15
e
1.27 TYP.
P
0.25
J
0.25
45 DEGREE 0.5MM CHAMFER (4 PLCS)
TOP VIEW
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
8
2. "e" REPRESENTS THE BASIC SOLDER BALL GRID PITCH.
3. "M" REPRESENTS THE BASIC SOLDER BALL MATRIX SIZE,
AND SYMBOL "N" IS THE MAXIMUM ALLOWABLE NUMBER OF
BALLS AFTER DEPOPULATING.
4. "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER
PARALLEL TO PRIMARY DATUM -C- .
5. DIMENSION "aaa" IS MEASURED PARALLEL TO PRIMARY DATUM -C- .
6. PRIMARY DATUM -C- AND SEATING PLANE ARE DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
7. PACKAGE SURFACE SHALL BE NICKEL PLATED.
8. AFTER SURFACE MOUNT ASSEMBLY, SOLDER BALL WILL
HAVE 0.15mm(TYP.) COLLAPSE IN "A" DIMENSION.
9. SUBSTRATE MATERIAL BASE IS COPPER.
10. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF PACKAGE BODY
11. 45 DEG. 0.5mm CHAMFER CORNER AND WHITE DOT FOR PIN 1 IDENTIFICATION
12. ENCAPSULANT SIZE MAY VARY WITH DIE SIZE.
13. CAVITY DEPTH C1 VARIOUS WITH DIE THICKNESS.
G52245-0, Rev 4.1
9/26/00
© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012
Tel: (800)-VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com
Internet: www.vitesse.com
Page 15
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