PCF85103C2D 查看數據表（PDF） - Philips Electronics
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PCF85103C2D Datasheet PDF : 20 Pages
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Philips Semiconductors
Contents
1
2
3
4
5
6
6.1
6.2
7
8
8.1
8.1.1
8.1.2
8.1.3
8.1.4
8.1.5
9
10
11
12
13
14
14.1
14.2
14.2.1
14.2.2
14.2.3
14.3
14.3.1
14.3.2
14.4
15
16
17
18
19
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Device addressing . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 6
I2C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . . 6
Bus conditions . . . . . . . . . . . . . . . . . . . . . . . . . 6
Data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Device addressing . . . . . . . . . . . . . . . . . . . . . . 7
Write operations . . . . . . . . . . . . . . . . . . . . . . . . 7
Read operations . . . . . . . . . . . . . . . . . . . . . . . . 9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 10
I2C-bus characteristics . . . . . . . . . . . . . . . . . . 11
Write cycle limits . . . . . . . . . . . . . . . . . . . . . . . 12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Surface mount packages . . . . . . . . . . . . . . . . 15
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 15
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 15
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 16
Through-hole mount packages . . . . . . . . . . . . 16
Soldering by dipping or by solder wave . . . . . 16
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 16
Package related soldering information . . . . . . 17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 19
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
PCF85103C-2
256 × 8-bit CMOS EEPROM with I2C-bus interface
© Koninklijke Philips Electronics N.V. 2002.
Printed in the U.S.A
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 09 May 2002
Document order number: 9397 750 09646
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