1T362A 查看數據表（PDF） - Sony Semiconductor
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1T362A Datasheet PDF : 4 Pages
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1T362A
Product Name and Package Specification for the 1T362A.
According to the classification number for the combination of capacitance deviations (hereafter ∆C), assembly
method and automatic mounting equipment section, the following product names are assigned.
Base model
1T362A
04
T8
A
Derived model 1T362A
M
20
A
T8
A
Note 1 : Package specification as ordered by customer
∗ Taping direction ∗ T8 only to consolidate specifications
Special selection symbol
Note 2 : ∆C kit number
Note 3 : Assembly method M=MAP
Note1) In taping packaging of products groups according to the ∆C classification, products must be divided
according to the group. If taping is performed without grouping into categories, products from two
different groups may be mounted on the same tuner, so that ∆C cannot be assured during tuning,
making tuning defective.
A: Panasert method; Sections are divided by four blank spaces on the carrier tape.
B: Sanyo method; Black tape is affixed to one blank space on the carrier tape to mark sections.
Note 2) ∆C kit number
When taping each group, taping is performed in kit number multiples.
01; Incomplete kit (∆C not guaranteed)
04; 4 kits
20; 20 kits
Recommended kit number; 4 and 20
Other) Minimum number of kits per group is 240 (60 or more at the beginning of the carrier tape). Up
to nine sections on one reel.
Note 3) “MAP” is the method where the neighboring chips are assembled continuously in order to enhance the
concentration of the capacitance deviation in a matching group.
—2—
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