LTC692CS8PBF 查看數據表（PDF） - Linear Technology

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LTC692CS8PBF

Microprocessor Supervisory Circuits

Linear Technology 

LTC692/LTC693

PACKAGE DESCRIPTION

N8 Package

8-Lead PDIP (Narrow .300 Inch)

(Reference LTC DWG # 05-08-1510)

.300 – .325

(7.620 – 8.255)

.045 – .065

(1.143 – 1.651)

.130 ± .005

(3.302 ± 0.127)

.400*

(10.160)

MAX

87

65

.008 – .015

(0.203 – 0.381)

.065

(1.651)

TYP

+.035

.325 –.015

( ) 8.255

+0.889

–0.381

.100

(2.54)

BSC

NOTE:

1. DIMENSIONS

ARE

INCHES

MILLIMETERS

*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)

.255 ± .015*

(6.477 ± 0.381)

.120

(3.048)

MIN

.018 ± .003

.020

(0.508)

MIN

(0.457 ± 0.076)

12

34

N8 1002

S8 Package

8-Lead Plastic Small Outline (Narrow .150 Inch)

(Reference LTC DWG # 05-08-1610)

.050 BSC

.045 ±.005

.189 – .197

(4.801 – 5.004)

NOTE 3

8

7

6

5

.245

MIN

.160 ±.005

.228 – .244

(5.791 – 6.197)

.150 – .157

(3.810 – 3.988)

NOTE 3

.030 ±.005

TYP

RECOMMENDED SOLDER PAD LAYOUT

1

2

.010 – .020 s 45°

(0.254 – 0.508)

.008 – .010

(0.203 – 0.254)

0°– 8° TYP

.053 – .069

(1.346 – 1.752)

.016 – .050

(0.406 – 1.270)

NOTE:

1. DIMENSIONS

IN

INCHES

(MILLIMETERS)

.014 – .019

(0.355 – 0.483)

TYP

2. DRAWING NOT TO SCALE

3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)

34

.004 – .010

(0.101 – 0.254)

.050

(1.270)

BSC

SO8 0303

0692fa

17

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