SSM2250 查看數據表（PDF） - Analog Devices
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SSM2250 Datasheet PDF : 12 Pages
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SSM2250
OUTLINE DIMENSIONS
3.00 BSC
10
3.00 BSC
1
6
4.90 BSC
5
PIN 1
0.50 BSC
0.95
0.85
1.10 MAX
0.75
0.80
0.15
0.27
0.00
0.17
SEATING 0.23
PLANE 0.08
8°
0°
0.60
0.40
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-BA
Figure 21. 10-Lead Mini Small Outline Package [MSOP]
(RM-10)
Dimensions shown in millimeters
5.10
5.00
4.90
14
4.50
4.40
4.30
8
6.40
BSC
1
7
PIN 1
1.05
0.65
1.00
BSC
0.80
1.20 0.20
MAX 0.09
0.75
0.15 0.30
0.05 0.19
SEATING
PLANE
8°
0°
COPLANARITY
0.10
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
Figure 22. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
ORDERING GUIDE
Model
SSM2250RM-R2
SSM2250RM-REEL
SSM2250RMZ-R21
SSM2250RMZ-REEL1
SSM2250RU-REEL
SSM2250RUZ-REEL1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
10-Lead MSOP
10-Lead MSOP
10-Lead MSOP
10-Lead MSOP
14-Lead TSSOP
14-Lead TSSOP
Package Option
RM-10
RM-10
RM-10
RM-10
RU-14
RU-14
1 Z = Pb-free part, # denotes Pb-free part; may be top or bottom marked.
Branding
AK
AK
AK#
AK#
© 2005 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
C00359–0–6/05(A)
Rev. A | Page 12 of 12
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