MAX197ACAI 查看數據表（PDF） - Maxim Integrated

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MAX197ACAI

Multi-Range (±10V, ±5V, +10V, +5V), Single +5V, 12-Bit DAS with 8+4 Bus Interface

Maxim Integrated 

Multi-Range (±10V, ±5V, +10V, +5V),

Single +5V, 12-Bit DAS with 8+4 Bus Interface

Transfer Function

Output data coding for the MAX197 is binary in unipo-

lar mode with 1LSB = (FS / 4096) and two’s-comple-

ment binary in bipolar mode with 1LSB = ((2 x |FS|) /

4096). Code transitions occur halfway between succes-

sive-integer LSB values. Figures 10 and 11 show the

input/output (I/O) transfer functions for unipolar and

bipolar operations, respectively. For full-scale (FS) val-

ues, see Table 1.

Layout, Grounding, and Bypassing

Careful printed circuit board layout is essential for best

system performance. For best performance, use a

ground plane. To reduce crosstalk and noise injection,

keep analog and digital signals separate. Digital

ground lines can run between digital signal lines to

minimize interference. Connect analog grounds and

DGND in a star configuration to AGND. For noise-free

operation, ensure the ground return from AGND to the

supply ground is low impedance and as short as possi-

ble. Connect the logic grounds directly to the supply

ground. Bypass VDD with 0.1µF and 4.7µF capacitors

to AGND to minimize high- and low-frequency fluctua-

tions. If the supply is excessively noisy, connect a 5Ω

resistor between the supply and VDD, as shown in

Figure 12.

SUPPLY

+5V

GND

R* = 5Ω

4.7µF

0.1µF

**

VDD

AGND

MAX197

DGND

+5V DGND

DIGITAL

CIRCUITRY

* OPTIONAL

** CONNECT AGND AND DGND WITH A GROUND PLANE OR A SHORT TRACE

_Ordering Information (continued)

PART

TEMP RANGE PIN-PACKAGE

MAX197AENI -40°C to +85°C 28 Narrow Plastic DIP

MAX197BENI -40°C to +85°C 28 Narrow Plastic DIP

MAX197AEWI -40°C to +85°C 28 Wide SO

MAX197BEWI -40°C to +85°C 28 Wide SO

MAX197AEAI -40°C to +85°C 28 SSOP

MAX197BEAI -40°C to +85°C 28 SSOP

MAX197AMYI -55°C to +125°C 28 Narrow Ceramic SB**

MAX197BMYI -55°C to +125°C 28 Narrow Ceramic SB**

** Contact factory for availability and processing to MIL-STD-883.

___________________Chip Topography

RD

HBEN

SHDN

D7

WR CLK

VDD

CS DGND

VCC

REF

REFADJ

INT

CH7

0.231"

(5.870mm)

CH6

CH5

D6

D5

CH4

D4

CH3

D3

CH2

D1

CH0

D2 D0 AGND

CH1

0.144"

(3.659mm)

TRANSISTOR COUNT: 2956

SUBSTRATE CONNECTED TO GND

Figure 12. Power-Supply Grounding Connection

______________________________________________________________________________________ 15

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