HCPL-4100-300(1999) 查看數據表（PDF） - HP => Agilent Technologies
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HCPL-4100-300 Datasheet PDF : 12 Pages
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3
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-4100)
1.19
(0.047)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
PAD LOCATION (FOR REFERENCE ONLY)
1.016 (0.040)
1.194 (0.047)
8
7
6
5
6.350 ± 0.25
(0.250 ± 0.010)
1
2
3
4
(40..812960)TYP.
9.398 (0.370)
9.906 (0.390)
1.194 (0.047)
1.778 (0.070)
0.381 (0.015)
0.635 (0.025)
1.780
(0.070)
MAX.
(04..11695)MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
0.254
+
-
0.076
0.051
(0.010+-
0.003)
0.002)
1.080 ± 0.320
(0.043 ± 0.013)
2.54
(0.100)
0.635 ± 0.130
(0.025 ± 0.005)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
Thermal Profile (Option #300)
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
∆T = 115°C, 0.3°C/SEC
∆T = 100°C, 1.5°C/SEC
1
23
4
5
6
7
8
TIME – MINUTES
∆T = 145°C, 1°C/SEC
9 10 11 12
Figure 1. Maximum Solder Reflow Thermal Profile.
(Note: Use of non-chlorine activated fluxes is recommended.)
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