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CLP30-200B1 查看數據表(PDF) - STMicroelectronics

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CLP30-200B1 Datasheet PDF : 15 Pages
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Characteristics
CLP30-200B1
Table 3. Absolute maximum ratings (RSENSE = 3 , Tamb = 25° C)
Symbol
Parameter
Value Unit
IPP
ITSM
Tstg
Tj
TL
Line to GND peak pulse current
– 10/1000 µs (open circuit voltage wave shape 10/1000 µs)
– 5/310 µs (open circuit voltage wave shape 10/700 µs)
Non repetitive surge peak on-state current
F = 50 Hz
tp = 10 ms
tp = 200 ms
tp = 1 s
Storage temperature range
Maximum junction temperature
Lead temperature for soldering during 10 s.
30
A
40
8.5
4.5
A
3.5
-40 to
+150
°C
150
260
°C
Table 4.
Symbol
Electrical characteristics (RSENSE = 3 , Tamb = 25° C)
Parameter
Test condtions
Min
Max Unit
VLG = 200 V
ILGL Line to GND leakage current Measured between TIP
(or RING) and GND
10 µA
VLG
VSWON
Line to GND operating voltage
Line to GND voltage at SW1 or Measured at 50 Hz between TIPL
SW2 switching-on
(or RINGL) and GND,one cycle
200 V
290 V
ISWOFF
Line to GND negative current
at SW1 or SW2 switching-off
Refer to test circuit fig 9
150
mA
ISWON
Line current at SW1 or SW2
switching-on
Positive surge
Negative surge
220
280
320
380
mA
C Line to GND capacitance
VLG = 0 V
VOSC = 200 mVRMS F = 1MHz
100 pF
Figure 3. Test circuit for ISWOFF parameter: GO-NO GO test
TIPL or RINGL
R
VBAT = -48 V
D.U.T
GND
-VP
Surge generator
This is a GO-NO GO test which allows to confirm the holding current (IH) level in a functional test circuit.
TEST PROCEDURE:
- Adjust the current level at the IH value by short circuiting the D.U.T.
- Fire the D.U.T. with a surge current: IPP = 10A, 10/1000 µs
- The D.U.T. will come back to the off-state within a duration of 50 ms max.
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