A75 查看數據表（PDF） - Intel

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A75

PENTIUM® PROCESSOR

Intel 

PENTIUM® PROCESSOR 75/90/100/120/133/150/166/200

E

Symbol

A

A1

A2

B

D

D1

D2

e1

F1

F2

L

N

S1

Table 22. PPGA Package Dimensions

Millimeters

Inches

Min

Max

Notes

Min

Max

2.72

3.33

0.107

0.131

1.83

2.23

0.072

0.088

1.00

0.039

0.40

0.51

0.016

0.020

49.43

49.63

1.946

1.954

45.59

45.85

1.795

1.805

23.44

23.95

0.923

0.943

2.29

2.79

0.090

0.110

17.56

0.692

23.04

0.907

3.05

3.30

0.120

0.130

296

Lead Count

296

1.52

2.54

0.060

0.100

Notes

Lead Count

5.0. THERMAL SPECIFICATIONS

Due to the advanced 3.3V BiCMOS process that it is

produced on, the Pentium processor

75/90/100/120/133/150/166/200 dissipates less

power than the Pentium processor 60/66 .

The Pentium processor 75/90/100/120/133/150/

166/200 is specified for proper operation when case

temperature, TCASE, (TC) is within the specified range

of 0°C to 70°C.

5.1. Measuring Thermal Values

To verify that the proper TC (case temperature) is

maintained, it should be measured at the center of

the package top surface (opposite of the pins). The

measurement is made in the same way with or

without a heat sink attached. When a heat sink is

attached, a hole (smaller than 0.150" diameter)

should be drilled through the heat sink to allow

probing the center of the package. See Figure 15 for

an illustration of how to measure TC.

To minimize the measurement errors, it is

recommended to use the following approach:

• Use 36-gauge or finer diameter K, T, or J type

thermocouples. The laboratory testing was done

using a thermocouple made by Omega (part

number: 5TC-TTK-36-36).

• Attach the thermocouple bead or junction to the

center of the package top surface using high

thermal conductivity cements. The laboratory

testing was done by using Omega Bond (part

number: OB-100).

62

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