ESDA14V2-4BF1(2002) 查看數據表（PDF） - STMicroelectronics
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ESDA14V2-4BF1 Datasheet PDF : 9 Pages
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ESDA14V2-4BF1
PACKAGE MECHANICAL DATA
DIE SIZE (all dimensions in µm)
700 ± 50
315 ± 50
650 ± 65
495 ± 50
MARKING
265
1270 ± 50
200
®
diam 230
EAT
220
40
YWW
1270
OTHER INFORMATION
Ordering code
Marking
ESDA14V2-4BF1
EAT
s YWW: Date code
Package
Flip-Chip
Weight
2.1 mg
Base qty
5000
Delivery mode
Tape & reel 7”
Note: More packing informations are available in the application note AN1235: "Flip-Chip: Package de-
scription and recommandations for use"
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 2002 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
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