74F125 查看數據表（PDF） - Philips Electronics

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74F125

Quad buffers (3-State)

Philips Electronics 

Philips Semiconductors

Quad buffers (3-State)

Product specification

74F125, 74F126

RECOMMENDED OPERATING CONDITIONS

SYMBOL

PARAMETER

VCC

VIH

VIL

IIK

IOH

IOL

Tamb

Supply voltage

High-level input voltage

Low-level input voltage

Input clamp current

High-level output current

Low-level output current

Operating free air temperature range

LIMITS

MIN

NOM

MAX

4.5

5.0

5.5

2.0

0.8

–18

–15

64

0

+70

UNIT

V

V

V

mA

mA

mA

°C

DC ELECTRICAL CHARACTERISTICS

(Over recommended operating free-air temperature range unless otherwise noted.)

SYMBOL

PARAMETER

TEST CONDITIONS1

LIMITS

MIN TYP2 MAX

UNIT

VOH

High-level output voltage

±10%VCC 2.4

V

VCC = MIN,

VIL = MAX,

IOH=–3mA

±5%VCC

2.7

3.3

V

VIH = MIN

±10%VCC 2.0

V

IOH=–15mA

±5%VCC

2.0

V

VOL

Low-level output voltage

VCC = MIN,

VIL = MAX,

VIH = MIN

IOH= MAX

±10%VCC

±5%VCC

0.55

V

0.42 0.55

V

VIK

II

IIH

IIL

IOZH

Input clamp voltage

Input current at maximum input voltage

High-level input current

Low-level input current

Off-state output current,

High-level voltage applied

VCC = MIN, II = IIK

VCC = 0.0V, VI = 7.0V

VCC = MAX, VI = 2.7V

VCC = MAX, VI = 0.5V

VCC = MAX, VO = 2.7V

–0.73 –1.2

V

100

µA

20

µA

–20

µA

50

µA

IOZL

Off-state output current,

Low-level voltage applied

VCC = MAX, VO = 0.5V

–50

µA

IOS

Short circuit output current3

VCC = MAX

–100

–225

mA

ICCH

OEn = GND, Dn = 4.5V

17

24

mA

74F125 ICCL VCC = MAX OEn = Dn = GND

28

40

mA

ICC

Supply current (total)

ICCZ

ICCH

OEn = Dn = 4.5V

OEn = Dn = 4.5V

25

35

mA

20

30

mA

74F126 ICCL VCC = MAX OEn = 4.5V, Dn = GND

32

48

mA

ICCZ

OEn = GND, Dn = 4.5V

26

39

mA

NOTES:

1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.

2. All typical values are at VCC = 5V, Tamb = 25°C.

3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold

techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting

of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any

sequence of parameter tests, IOS tests should be performed last.

March 28, 1989

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