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HCS166D/SAMPLE 查看數據表(PDF) - Intersil
零件编号
产品描述 (功能)
生产厂家
HCS166D/SAMPLE
Radiation Hardened 8-Bit Parallel-Input/Serial Output Shift Register
Intersil
HCS166D/SAMPLE Datasheet PDF : 9 Pages
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HCS166MS
Die Characteristics
DIE DIMENSIONS:
94 x 94 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11k
Å
±
1k
Å
GLASSIVATION:
Type: SiO
2
Thickness: 13k
Å
±
2.6k
Å
WORST CASE CURRENT DENSITY:
< 2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
µ
m x 100
µ
m
4 mils x 4 mils
Metallization Mask Layout
HCS166MS
D1
D0
DS
VCC
PE
(3)
(2)
(1)
(16)
(15)
D2 (4)
D3 (5)
CE (6)
(14) D7
(13) Q7
(12) D6
(7)
(8)
(9)
(10)
(11)
CP
GND
MR
D4
D5
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS166 is TA14386A.
Spec Number
518758
258
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