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零件编号
产品描述 (功能)
HCTS20D 查看數據表(PDF) - Intersil
零件编号
产品描述 (功能)
生产厂家
HCTS20D
Radiation Hardened Dual 4-Input NAND Gate
Intersil
HCTS20D Datasheet PDF : 8 Pages
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Die Characteristics
DIE DIMENSIONS:
2.20 x 2.24(mm)
METALLIZATION:
Type: SiAl
Metal Thickness: 11k
Å
±
1k
Å
GLASSIVATION:
Type: SiO
2
Thickness: 13k
Å
±
2.6k
Å
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
µ
m x 100
µ
m
4 mils x 4 mils
Metallization Mask Layout
HCTS20MS
HCTS20MS
A1
VCC
D2
(1)
(14)
(13)
B1 (2)
NC (3)
(12) C2
(11) NC
C1 (4)
(10) B2
D1 (5)
(9) A2
(6)
(7)
(8)
Y1
GND
Y2
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS20 is TA14426A.
Spec Number
518619
427
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