TS924AIP 查看數據表（PDF） - STMicroelectronics
零件编号
产品描述 (功能)
生产厂家
TS924AIP Datasheet PDF : 14 Pages
| |||
Package information
4
Package information
TS924
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK® packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
4.1
DIP14 package information
Figure 13. DIP14 package mechanical drawing
10/14
Table 6.
Ref.
a1
B
b
b1
D
E
e
e3
F
I
L
Z
DIP14 package mechanical data
Millimeters
Min.
0.51
1.39
1.27
Typ.
0.5
0.25
8.5
2.54
15.24
3.3
Max.
1.65
20
7.1
5.1
2.54
Min.
0.020
0.055
0.050
Inches
Typ.
0.020
0.010
0.335
0.100
0.600
0.130
Max.
0.065
0.787
0.280
0.201
0.100
Share Link: 