BYX10G 查看數據表（PDF） - Philips Electronics

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BYX10G

Rectifier

Philips Electronics 

Philips Semiconductors

Rectifier

Product specification

BYX10G

FEATURES

• Glass passivated

• High maximum operating

temperature

• Low leakage current

• Excellent stability

• Available in ammo-pack.

DESCRIPTION

Rugged glass package, using a high

temperature alloyed construction.

This package is hermetically sealed

and fatigue free as coefficients of

expansion of all used parts are

matched.

2/3 pagek(Datasheet)

a

MAM047

Fig.1 Simplified outline (SOD57) and symbol.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL

PARAMETER

CONDITIONS

VRSM

VRRM

VRWM

IF(AV)

IFSM

Tstg

Tj

non-repetitive peak reverse voltage

repetitive peak reverse voltage

crest working reverse voltage

average forward current

non-repetitive peak forward current

storage temperature

junction temperature

Ttp = 50 °C;

lead length = 10 mm;

averaged over any 20 ms

period; see Figs 2 and 4

Tamb = 60 °C; PCB mounting

(see Fig.9); averaged over any

20 ms period; see Figs 3 and 4

t = 10 ms half sinewave;

Tj = Tj max prior to surge;

VR = VRWMmax

see Fig.5

MIN.

−

−

−

−

MAX. UNIT

1600 V

1600 V

800 V

1.2 A

−

0.6 A

−

25 A

−65 +175 °C

−65 +175 °C

1996 May 24

2

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