STPAC01F1 查看數據表（PDF） - STMicroelectronics
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STPAC01F1 Datasheet PDF : 6 Pages
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PACKAGE MECHANICAL DATA
500µm ± 50
315µm ± 50
STPAC01F1
650µm ± 65
1.57mm ± 50µm
FOOT PRINT RECOMMENDATIONS
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 300µm copper pad diameter
MARKING
Dot, ST logo
xxx = marking
yww = datecode
(y = year
ww = week)
365
240
All dimensions in µm
xxx
y ww
5/6
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