STM961-15B 查看數據表（PDF） - STMicroelectronics
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STM961-15B Datasheet PDF : 7 Pages
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STM961-15B
APPLICATIONS RECOMMENDATIONS
OPERATION LIMITS
The STM961-15B power module should never
be operated under any condition which exceeds
the Absolute Maximum Ratings presented on
this data sheet. Nor should the module be
operated continuously at any of the specified
maximum ratings. If the module is to be
subjected to one or more of the maximum rating
conditions, care must be taken to monitor other
parameters which may be affected.
DECOUPLING
Failure to properly decouple any of the voltage
supply pins will result in oscillations at certain
operating frequencies. Therefore, it is
recommended that these pins be bypassed as
indicated in the Module DC and Test Fixture
Configuration drawing of this data sheet.
MODULE MOUNTING
To insure adequate thermal transfer from the
module to the heatsink, it is recommended that
a satisfactory thermal compound such as Dow
Corning 340, Wakefield 120-2 or equivalent be
applied between the module flange and the
heatsink.
The heatsink mounting surface under the
module should be flat to within ± 0.05mm (±
0.002 inch). The module should be mounted to
the heatsink using 3.5 mm (or 6-32) or
equivalent screws torqued to 5-6 kg-cm (4-6
in-lb).
The module leads should be attached to
equipment PC board using 180°C solder
applied to the leads with a properly grounded
soldering iron tip, not to exceed 195°C, applied
a minimum of 2 mm (0.080 inch) from the body
of the module for a duration not to exceed 15
seconds per lead. It is imperative that no other
portion of the module, other than the leads, be
subjected to temperatures in excess of 100°C
(maximum storage temperature), for any period
of time, as the plastic moulded cover, internal
components and sealing adhesives may be
adversely affected by such conditions.
Due to the construction techniques and
materials used within the module, reflow
soldering of the flange heatsink or leads, is not
recommended.
THERMAL CONSIDERATIONS
It will be necessary to provide a suitable
heatsink in order to maintain the module flange
temperature at or below to maximum case
operating temperature. In a case where the
module output power limited to +42 dBm CW
and designing for the worst case efficiency of
32%, the power dissipated by the module will
be 33.6 Watts. The heatsink must be designed
such that the thermal rise will be less than the
difference between the maximum operating
case temperature of the module while
dissipating 33.6 W.
At Tcase = +85 oC, V = 26V, ZL = 50 Ω and POUT
= 42 dBm, maximum junction temperatures for
the individual transistors should be below the
following values:
Q1 = 140 oC, Q2 = 145 oC, Q3 = 130 oC.
5/7
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