STM1645-10 查看數據表（PDF） - STMicroelectronics

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STM1645-10

RF POWER MODULES SATELLITE COMMUNICATIONS APPLICATIONS

STMicroelectronics 

STM1645-10

APPLICATIONS RECOMMENDATIONS

OPERATION LIMITS

The STM1645-10 power module should never be

operated under any condition which exceeds the

Absolute Maximum Ratings presented on this

data sheet. Nor should the module be operated

continuously at any of the specified maximum rat-

ings. If the module is to be subjected to one or

more of the maximum rating conditions, care must

be taken to monitor other parameters which may

be affected.

DECOUPLING

Failure to properly decouple any of the voltage

supply pins mayl result in oscillations at certain

operating frequencies. Therefore, it is recom-

mended that these pins be bypassed as indicated

in the Module DC and Test Fixture Configuration

drawing of this data sheet.

POWER CONTROL

The recommeded method of power control for the

STM1645-10 is to set PIN = 10mW, VC1 = 18V

and VC2 = 28 volts nominal at a flange tempera-

ture of 25°C to achieve an output power of 10

watts. Varing VC2 will allow stable power control

over a wide range of flange temperature. The cur-

rent consumption of VC2 is typically 850mA to

900mA for 10 watts power ouput.

MODULE MOUNTING

To insure adequate thermal transfer from the

module to the heatsink, it is recommended that a

satisfactory thermal compound such as Dow

Corning 340, Wakefield 120-2 or equivalent be

applied between the module flange and the

heatsink.

The heatsink mounting surface under the module

should be flat to within ± 0.05mm (± 0.002 inch).

The module should be mounted to the heatsink

using 3 mm (or 4-40) or equivalent screws tor-

qued to 5-6 kg-cm (4-6 in-lb).

The module leads should be attached to equip-

ment PC board using 180°C solder applied to the

leads with a properly grounded soldering iron tip,

not to exceed 195°C, applied a minimum of 2mm

(0.080 inch) from the body of the module for a

duration not to exceed 15 seconds per lead. It is

imperative that no other portion of the module,

other than the leads, be subjected to tempera-

tures in excess of 100°C (maximum storage tem-

perature), for any period of time, as the plastic

moulded cover, internal components and sealing

adhesives may be adversely affected by such

conditions.

Due to the construction techniques and materials

used within the module, reflow soldering of the

flange heatsink or leads, is not recommended.

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