UPC2721GR-E2 查看數據表（PDF） - NEC => Renesas Technology

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UPC2721GR-E2

GENERAL PURPOSE L-BAND DOWN CONVERTER ICs

NEC => Renesas Technology 

µPC2721, µPC2722

RECOMMENDED SOLDERING CONDITIONS

The following conditions (see table below) must be met when soldering this product.

Please consult with our sales officers in case other soldering process is used or in case soldering is done under

different conditions.

For details of recommended soldering conditions for surface mounting, refer to information document

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

µPC2721/22

Soldering process

Infrared ray reflow

VPS

Wave soldering

Partial heating method

Soldering conditions

Peak package’s surface temperature: 235 °C or below,

Reflow time: 30 seconds or below (210 °C or higher),

Number of reflow process: 3, Exposure limitNote: None

Peak package’s surface temperature: 215 °C or below,

Reflow time: 40 seconds or below (200 °C or higher),

Number of reflow process: 3, Exposure limitNote: None

Solder temperature: 260 °C or below,

Flow time: 10 seconds or below,

Number of flow process: 1, Exposure limitNote: None

Terminal temperature: 300 °C or below,

Flow time: 3 seconds or below,

Exposure limitNote: None

Symbol

IR35-00-3

VP15-00-3

WS60-00-1

Note Exposure limit before soldering after dry-pack package is opened.

Storage conditions: 25 °C and relative humidity at 65 % or less.

Caution Do not apply more than single process at once, except the “Partial heating method”.

Data Sheet P11102EJ4V0DS00

11

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