DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

FDS8433A 查看數據表(PDF) - Fairchild Semiconductor

零件编号
产品描述 (功能)
生产厂家
FDS8433A
Fairchild
Fairchild Semiconductor Fairchild
FDS8433A Datasheet PDF : 5 Pages
1 2 3 4 5
DMOS Electrical Characteristics
Symbol
Parameter
TA = 25°C unless otherwise noted
Test Conditions
Min Typ Max Units
Off Characteristics
BVDSS
Drain-Source Breakdown Voltage
BVDSS
TJ
IDSS
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
VGS = 0 V, ID = -250 µA
-20
ID = -250 µA, Referenced to 25°C
-25
VDS = -16 V, VGS = 0 V
V
mV/°C
-1
µA
IGSSF
Gate-Body Leakage Current, Forward VGS = 8 V, VDS = 0 V
100 nA
IGSSR
Gate-Body Leakage Current, Reverse VGS = -8 V, VDS = 0 V
-100 nA
On Characteristics (Note 2)
VGS(th)
Gate Threshold Voltage
VGS(th)
TJ
Gate Threshold Voltage
Temperature Coefficient
RDS(on)
Static Drain-Source
On-Resistance
ID(on)
On-State Drain Current
gFS
Forward Transconductance
VDS = VGS, ID = -250 µA
-0.4 -0.6
ID = -250 µA, Referenced to 25°C
4
-1
V
mV/°C
VGS = -4.5 V, ID = -5 A
VGS = -4.5 V, ID = -5 A, TJ=125°C
VGS = -2.5 V, ID = -4.3 A
0.036 0.047
0.050 0.085
0.047 0.070
VGS = -4.5 V, VDS = -5 V
-25
A
VDS = -5 V, ID = -5 A
16
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VDS = -10 V, VGS = 0 V,
f = 1.0 MHz
1130
pF
480
pF
120
pF
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
(Note 2)
VDD = -10 V, ID = -1 A,
VGS = -4.5 V, RGEN = 6
VDS = -5 V, ID = -5 A,
VGS = -5 V,
8
16
ns
23 37
ns
260 360 ns
90 125 ns
20
28
nC
2.8
nC
3.2
nC
Drain-Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain-Source Diode Forward Current
VSD
Drain-Source Diode Forward Voltage VGS = 0 V, IS = -2.1 A (Note 2)
-2.1
A
-0.8 -1.2
V
Notes:
1: RθJA is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface of the
drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a) 50° C/W when
mounted on a 1 in2
pad of 2 oz. copper.
b) 105° C/W when
mounted on a 0.04 in2
pad of 2 oz. copper.
c) 125° C/W on a minimum
mounting pad of 2 oz. copper.
Scale 1 : 1 on letter size paper
2: Pulse Test: Pulse Width 300 µs, Duty Cycle 2.0%
FDS8433A Rev. C

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]