CXK5B81020TM 查看數據表（PDF） - Sony Semiconductor

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CXK5B81020TM

131072-word × 8-bit High Speed Bi-CMOS Static RAM

Sony Semiconductor 

Package Outline

Unit: mm

CXK5B81020J

32

32PIN SOJ (PLASTIC) 400mil

+ 0.4

20.96 – 0.12

17

CXK5B81020J/TM

R0.254 1

0.73 ± 0.08

16

1.27

+ 0.2

2.2 – 0.11

0.1

0.43 ± 0.1

0.95

φ0.178 M

SONY CODE

EIAJ CODE

JEDEC CODE

SOJ-32P-01

∗SOJ032-P-0400-A

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY RESIN

LEAD TREATMENT

LEAD MATERIAL

PACKAGE WEIGHT

SOLDER PLATING

42 / COPPER ALLOY

1.3g

CXK5B81020TM

32

32PIN TSOP (II) (PLASTIC) 400mil

∗20.95 ± 0.1

17

A

1.27 MAX

0.1

1

1.27

0.4 ± 0.1

16

0.21 M

+ 0.05

0.127 – 0.02

0.1 ± 0.1

NOTE: Dimension “∗” does not include mold protrusion.

0° to 10°

DETAIL A

SONY CODE

EIAJ CODE

JEDEC CODE

TSOP (II) -32P-L01

TSOP (II) 032-P-0400-A

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE WEIGHT

EPOXY / PHENOL RESIN

SOLDER PLATING

42 ALLOY

–9–

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