VSC7711 查看數據表（PDF） - Vitesse Semiconductor

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VSC7711

Transimpedance Amplifier Family for Optical Communication

Vitesse Semiconductor 

VITESSE

SEMICONDUCTOR CORPORATION

Transimpedance Amplifier

Family for Optical Communication

Advance Product Information

VSC7711

Thermal Resistance Calculation For Bare Die

In order to relate the junction temperature to the temperature of the back side of the bare die, the following

thermal characteristics of the package are provided

Table 5: Thermal Resistance Calculation for Bare Die.

Chip Size

Chip Area A

Die height (Tdie)

0.168cm x 0.104cm

0.015 cm2

0.066 cm

K GaAs

Thermal Conductivities

0.55W / cm °C

Thermal Path

Tj

θGaAs

Tb

θGaAs =

Tdie

KGaAsA

=

0.066

0.55 x 0.015

= 8°C/W

θJB = Thermal Resistance from Junction to back = 8°C/W

Example:

For VSC7711 at nominal supply current of 25mA and VDD = 5V

Temperature rise from junction to back = 0.025A x 5V x 8°C/W = 1°C

Page 4

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G52178-0, Rev 2.1

10/6/99

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