NE592(2016) 查看數據表（PDF） - ON Semiconductor
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NE592 Datasheet PDF : 10 Pages
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D
14
H
1
0.25 M B M
0.10
e
NE592
PACKAGE DIMENSIONS
SOIC−14
CASE 751A−03
ISSUE L
A
B
8
E
7
13X b
0.25 M C A S B S
A
A1
C
SEATING
PLANE
L
DETAIL A
h
X 45_
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
A3
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
DETAIL A
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 1.35 1.75 0.054 0.068
A1 0.10 0.25 0.004 0.010
A3 0.19 0.25 0.008 0.010
b 0.35 0.49 0.014 0.019
D 8.55 8.75 0.337 0.344
E 3.80 4.00 0.150 0.157
e
1.27 BSC
0.050 BSC
H 5.80 6.20 0.228 0.244
h 0.25 0.50 0.010 0.019
L 0.40 1.25 0.016 0.049
M 0_ 7_ 0_ 7_
SOLDERING FOOTPRINT*
6.50
1
14X
1.18
14X
0.58
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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10
NE592/D
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