8S003F3 查看數據表（PDF） - STMicroelectronics

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产品描述 (功能)

生产厂家

8S003F3

V alue line, 16 MHz STM8S 8-bit MCU, 8 Kbytes Flash, 128 bytes data EEPROM, 10-bit ADC, 3 timers, UART , SPI, I2C

STMicroelectronics 

List of figures

STM8S003F3 STM8S003K3

Figure 48.

Figure 49.

Figure 50.

Figure 51.

Figure 52.

Figure 53.

TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch, 

package footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92

TSSOP20 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

UFQFPN20 - 20-lead, 3 x 3 mm, 0.5 mm pitch, ultra thin fine pitch quad flat 

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94

UFQFPN20 - 20-lead, 3 x 3 mm, 0.5 mm pitch, ultra thin fine pitch quad flat 

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

UFQFPN20 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

STM8S003F3/K3 value line ordering information scheme(1) . . . . . . . . . . . . . . . . . . . . . . . 99

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DocID018576 Rev 6

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