80SQ045 查看數據表（PDF） - ON Semiconductor
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80SQ045 Datasheet PDF : 4 Pages
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80SQ045N
75
70
65
60
55
50
45
40
35
30
0
See Note 2
2
4
6
8
10
RqJA (°C/W)
Figure 5. RqJA versus Copper Area
9
8
7
RqJL = 12°C/W
6
5
4
dc
SQUARE
WAVE
3
2
1
0
0
20
40 60
80 100 120 140
TL, LEAD TEMPERATURE (°C)
Figure 6. Current Derating − Lead
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
0
SQUARE
WAVE
dc
TJ = 125°C
2
4
6
8
10
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 7. Forward Power Dissipation
NOTE 2 — MOUNTING DATA
Mounting Method
P.C. Board with 6.75 sq. in.
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
copper surface.
L = 3/8,
Board Ground Plane
1
D = 0.5
0.2
0.1
0.1
0.05
0.01
0.01
SINGLE PULSE
0.001
0.0001
0.001
Copper Area = 0.271 sq. in.
RqJA = 61.8 °C/W
0.01
0.1
1.0
10
t, TIME (sec)
Figure 8. Thermal Response, Junction−to−Ambient
P(pk)
t1
t2
DUTY CYCLE, D = t1/t2
100
1000
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