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AD5292 查看數據表(PDF) - Analog Devices

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AD5292 Datasheet PDF : 30 Pages
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AD5291/AD5292
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 8.
Parameter
VDD to GND
VSS to GND
VLOGIC to GND
VDD to VSS
VA, VB, VW to GND
Digital Input and Output Voltage to GND
EXT_CAP Voltage to GND
IA, IB, IW
Continuous
RAB = 20 kΩ
RAB = 50 kΩ, 100 kΩ
Pulsed1
Frequency > 10 kHz
Frequency ≤ 10 kHz
Operating Temperature Range4
Maximum Junction Temperature (TJ max)
Storage Temperature Range
Reflow Soldering
Peak Temperature
Time at Peak Temperature
Package Power Dissipation
Rating
−0.3 V to +35 V
+0.3 V to − 25 V
−0.3 V to + 7 V
35 V
VSS − 0.3 V, VDD+ 0.3 V
−0.3 V to VLOGIC + 0.3 V
−0.3 V to +7 V
±3 mA
±2mA
MCC2/d3
MCC2/√d3
−40°C to +105°C
150°C
−65°C to +150°C
260°C
20 sec to 40 sec
(TJ max − TA)/θJA
1 Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
2 Maximum continuous current
3 Pulse duty factor.
4 Includes programming of OTP memory.
Data Sheet
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θJA is defined by JEDEC specification JESD-51 and the value is
dependent on the test board and test environment.
Table 9. Thermal Resistance
Package Type
θJA
θJC
Unit
14-Lead TSSOP
931
20
°C/W
1 JEDEC 2S2P test board, still air (0 m/sec to 1 m/sec airflow).
ESD CAUTION
Rev. E | Page 10 of 30

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