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FOD815S 查看數據表(PDF) - Fairchild Semiconductor

零件编号
产品描述 (功能)
生产厂家
FOD815S Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
Package Dimensions
(Through Hole)
0.200 (5.10)
0.161 (4.10)
0.312 (7.92)
0.288 (7.32)
0.276 (7.00)
0.236 (6.00)
0.157 (4.00)
0.118 (3.00)
0.130 (3.30)
0.091 (2.30)
0.150 (3.80)
0.110 (2.80)
0.110 (2.79)
0.090 (2.29)
0.020 (0.51)
TYP
0.024 (0.60)
0.016 (0.40)
0.300 (7.62)
typ
0.010 (0.26)
Package Dimensions
(Surface Mount)
0.200 (5.10)
0.161 (4.10)
0.157 (4.00)
0.118 (3.00)
0.051 (1.30)
0.043 (1.10)
0.024 (0.60)
0.004 (0.10)
0.110 (2.79)
0.090 (2.29)
Lead Coplanarity 0.004 (0.10) MAX
0.312 (7.92)
0.288 (7.32)
0.276 (7.00)
0.236 (6.00)
0.049 (1.25)
0.030 (0.76)
0.412 (10.46)
0.388 (9.86)
Package Dimensions
(0.4" Lead Spacing)
0.200 (5.10)
0.161 (4.10)
0.157 (4.00)
0.118 (3.00)
0.312 (7.92)
0.288 (7.32)
0.276 (7.00)
0.236 (6.00)
0.130 (3.30)
0.091 (2.30)
0.150 (3.80)
0.110 (2.80)
0.024 (0.60)
0.016 (0.40)
0.110 (2.79)
0.090 (2.29)
0.110 (2.80)
0.011 (1.80)
0.42 (10.66)
0.38 (9.66)
Note:
All dimensions are in inches (millimeters)
0.291 (7.40)
0.252 (6.40)
0.010 (0.26)
Footprint Dimensions
(Surface Mount))
1.5
1.3
9
2.54
0.010 (0.26)
5
FOD815 Series Rev. 1.0.4
www.fairchildsemi.com

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