EP1C3Q104I6 查看數據表（PDF） - Altera Corporation
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EP1C3Q104I6 Datasheet PDF : 104 Pages
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Features
Cyclone devices are available in quad flat pack (QFP) and space-saving
FineLine® BGA packages (see Table 1–2 through 1–3).
Table 1–2. Cyclone Package Options & I/O Pin Counts
Device
EP1C3
EP1C4
EP1C6
EP1C12
EP1C20
100-Pin TQFP 144-Pin TQFP 240-Pin PQFP 256-Pin
324-Pin
400-Pin
(1)
(1), (2)
(1)
FineLine BGA FineLine BGA FineLine BGA
65
104
249
301
98
185
185
173
185
249
233
301
Notes to Table 1–2:
(1) TQFP: thin quad flat pack.
PQFP: plastic quad flat pack.
(2) Cyclone devices support vertical migration within the same package (i.e., designers can migrate between the
EP1C3 device in the 144-pin TQFP package and the EP1C6 device in the same package)
Vertical migration means you can migrate a design from one device to
another that has the same dedicated pins, JTAG pins, and power pins, and
are subsets or supersets for a given package across device densities. The
largest density in any package has the highest number of power pins; you
must use the layout for the largest planned density in a package to
provide the necessary power pins for migration.
For I/O pin migration across densities, cross-reference the available I/O
pins using the device pin-outs for all planned densities of a given package
type to identify which I/O pins can be migrated. The Quartus® II
software can automatically cross-reference and place all pins for you
when given a device migration list. If one device has power or ground
pins, but these same pins are user I/O on a different device that is in the
migration path,the Quartus II software ensures the pins are not used as
user I/O in the Quartus II software. Ensure that these pins are connected
to the appropriate plane on the board. The Quartus II software reserves
I/O pins as power pins as necessary for layout with the larger densities
in the same package having more power pins.
Altera Corporation
January 2007
1–3
Preliminary
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