HCPL-0710-060E 查看數據表（PDF） - Avago Technologies
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HCPL-0710-060E Datasheet PDF : 17 Pages
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Small Outline SO-8 Package
3.937 ± 0.127
(0.155 ± 0.005)
8765
DEVICE PART
NUMBER
LEAD-FREE
PIN 1
•NNNN Z
YYWW
EEE
1234
TEST RATING CODE
DATE CODE
LOT ID
5.994 ± 0.203
(0.236 ± 0.008)
0.406 ± 0.076
(0.016 ± 0.003)
(10..207500)BSC
*5.080 ± 0.127
(0.200 ± 0.005)
LAND PATTERN RECOMMENDATION
7.49 (0.295)
1.9 (0.075)
0.64 (0.025)
7°
45°
X
0.432
(0.017)
3.175 ± 0.127
(0.125 ± 0.005)
1.524
(0.060)
0 ~ 7°
0.228 ± 0.025
(0.009 ± 0.001)
* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
OPTION NUMBER 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
0.203 ± 0.102
(0.008 ± 0.004)
(00..300152)MIN.
Test Rating Code, Z
L – Option x2x
V – Option x5x or x6x
Optional Identification Code
A – Avago
– UL Logo
P – Special Program Code
Solder Reflow Thermal Profile
Recommended reflow condition as per JEDEC Standard, J-STD-020 (latest revision). Non-Halide Flux should be used.
Regulatory Information
The HCPL-x710 have been approved by the following organizations:
UL
Recognized under UL 1577, component recognition program, File E55361.
CSA Approved under CSA Component Acceptance Notice #5, File CA 88324.
IEC/EN/DIN EN 60747-5-5
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