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SIR472

N-Channel 30 V (D-S) MOSFET

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Application Note AN821

Vishay Siliconix

PowerPAK® SO-8 Mounting and Thermal Considerations

PowerPAK SO-8 DUAL

The pin arrangement (drain, source, gate pins) and the pin

dimensions of the PowerPAK SO-8 dual are the same as

standard SO-8 dual devices. Therefore, the PowerPAK

device connection pads match directly to those of the SO-8.

As in the single-channel package, the only exception is the

extended drain connection area. Manufacturers can likewise

take immediate advantage of the PowerPAK SO-8 dual

devices by mounting them to existing SO-8 dual land

patterns.

To take the advantage of the dual PowerPAK SO-8’s

thermal performance, the minimum recommended land

pattern can be found in Application Note 826,

Recommended Minimum Pad Patterns With Outline

Drawing Access for Vishay Siliconix MOSFETs. Click on the

PowerPAK 1212-8 dual in the index of this document.

The gap between the two drain pads is 24 mils. This

matches the spacing of the two drain pads on the

PowerPAK SO-8 dual package.

REFLOW SOLDERING

Vishay Siliconix surface-mount packages meet solder reflow

reliability requirements. Devices are subjected to solder

reflow as a test preconditioning and are then

reliability-tested using temperature cycle, bias humidity,

HAST, or pressure pot. The solder reflow temperature profile

used, and the temperatures and time duration, are shown in

figures 3 and 4.

For the lead (Pb)-free solder profile, see

www.vishay.com/doc?73257.

Fig. 3 Solder Reflow Temperature Profile

Ramp-Up Rate

Temperature at 150 - 200 °C

Temperature Above 217 °C

Maximum Temperature

Time at Maximum

Temperature

Ramp-Down Rate

+ 3 °C /s max.

120 s max.

60 - 150 s

255 + 5/- 0 °C

30 s

+ 6 °C/s max.

150 - 200 °C

260 °C

3 °C(max)

30 s

217 °C

60 s (min.)

Pre-Heating Zone

150 s (max.)

Reflow Zone

Maximum peak temperature at 240 °C is allowed.

6 °C/s (max.)

Fig. 4 Solder Reflow Temperatures and Time Durations

Revision: 16-Mai-13

2

Document Number: 71622

For technical questions, contact: powermosfettechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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