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74HCT00BQ(2010) 查看數據表(PDF) - NXP Semiconductors.

零件编号
产品描述 (功能)
生产厂家
74HCT00BQ
(Rev.:2010)
NXP
NXP Semiconductors. NXP
74HCT00BQ Datasheet PDF : 15 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
NXP Semiconductors
12. Package outline
DIP14: plastic dual in-line package; 14 leads (300 mil)
74HC00; 74HCT00
Quad 2-input NAND gate
SOT27-1
D
L
Z
e
b
14
pin 1 index
A2 A
A1
wM
b1
8
ME
c
(e 1)
MH
E
1
7
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.13
0.53
0.38
0.36 19.50 6.48
0.23 18.55 6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
2.2
inches 0.17
0.02
0.13
0.068 0.021 0.014
0.044 0.015 0.009
0.77
0.73
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01 0.087
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
SOT27-1
IEC
050G04
REFERENCES
JEDEC
JEITA
MO-001
SC-501-14
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Fig 8. Package outline SOT27-1 (DIP14)
74HC_HCT00_4
Product data sheet
Rev. 04 — 11 January 2010
© NXP B.V. 2010. All rights reserved.
8 of 15

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