NE5532 查看數據表（PDF） - ON Semiconductor
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NE5532 Datasheet PDF : 10 Pages
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NE5532, SA5532, SE5532, NE5532A, SE5532A
PACKAGE DIMENSIONS
NOTE 8
A1
D1
8−Pin Plastic Dual In−Line Package (PDIP−8)
N SUFFIX
CASE 626−05
ISSUE N
D
A
8
5
E1
1
4
b2 B
TOP VIEW
A2
e/2
A NOTE 3
L
E
H
c
END VIEW
WITH LEADS CONSTRAINED
NOTE 5
e
SIDE VIEW
SEATING
PLANE
C
M
8X b
0.010 M C A M B M
eB
END VIEW
NOTE 6
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE NOT
TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
INCHES
DIM MIN MAX
A −−−− 0.210
A1 0.015 −−−−
A2 0.115 0.195
b 0.014 0.022
b2 0.060 TYP
C 0.008 0.014
D 0.355 0.400
D1 0.005 −−−−
E 0.300 0.325
E1 0.240 0.280
e 0.100 BSC
eB −−−− 0.430
L 0.115 0.150
M −−−− 10 °
MILLIMETERS
MIN MAX
−−− 5.33
0.38 −−−
2.92 4.95
0.35 0.56
1.52 TYP
0.20 0.36
9.02 10.16
0.13 −−−
7.62 8.26
6.10 7.11
2.54 BSC
−−− 10.92
2.92 3.81
−−−
10 °
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