STPS2L60A 查看數據表（PDF） - STMicroelectronics
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STPS2L60A Datasheet PDF : 9 Pages
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Characteristics
STPS2L60
Figure 7.
Non repetitive surge peak forward
current versus overload duration
(maximum values) (DO-41)
IM(A)
10
9
8
7
6
5
4
3
2
IM
1
0
1.E-03
t
δ=0.5
1.E-02
t(s)
1.E-01
Ta=25°C
Ta=75°C
Ta=125°C
1.E+00
Figure 8.
IM(A)
30
25
Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMB flat)
SMBflat
20
15
10
5
IM
0
1.E-03
t
δ=0.5
t(s)
1.E-02
1.E-01
TL=25°C
TL=75°C
TL=125°C
1.E+00
Figure 9.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMA)
Zth(j-a)/Rth(j-a)
1.0
epoxy printed circuit board FR4, copper thickness: 35 µm
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1 Single pulse
0.0
1.E-02
1.E-01
tp(s)
1.E+00
1.E+01
1.E+02
Figure 10. Relative variation of thermal
impedance junction to ambient
versus pulse duration (DO-41)
Zth(j-a)/Rth(j-a)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.E-01
Single pulse
1.E+00
tp(s)
1.E+01
1.E+02
1.E+03
Figure 11. Relative variation of thermal
Figure 12. Reverse leakage current versus
impedance junction to lead versus
reverse voltage applied
pulse duration (SMB flat)
(typical values)
Zth(j-l)/Rth(j-l)
1.0
epoxy printed circuit board FR4, copper thickness: 35 µm
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Single pulse
0.0
1.E-04
1.E-03
tp(s)
1.E-02
1.E-01
1.E+00
IR(µA)
1.E+05
1.E+04
1.E+03
1.E+02
Tj=150°C
Tj=125°C
Tj=100°C
Tj=75°C
Tj=50°C
1.E+01
1.E+00
0
Tj=25°C
VR(V)
10
20
30
40
50
60
4/9
Doc ID 9173 Rev 6
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