ADA10001S3C
D
C
LE
EH
0.015 [0.38]X45
L
A
e
B1
S
YM
B
O
L
A
A1
A2
B
B1
C
D
E
e
H
L
LE
a
INCHES
MIN.
0.058
MAX.
0.068
0.004 0.010
0.055 0.065
0.013 0.020
0.062 0.070
0.008 0.010
0.380 0.400
0.150 0.160
0.050 BSC
0.226 0.244
0.016 0.040
0.030
0
8
MILLIMETERS
MIN.
1.47
MAX.
1.73
NOTE
0.10
0.25
1.40
1.65
0.33
0.50
1.58
1.78
0.20
0.25
4
9.66
10.16
2
3.81
4.06
3
1.27 BSC
5.74
6.20
0.41
1.02
0.76
0
8
a
A2
A1
GAUGE PLANE
0.003 [0.076mm]
SEATING PLANE
B
NOTES:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSION "D" DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS
AND GATE BURRS SHALL NOT EXCEED 0.006 [0.15mm]
PER SIDE.
3. DIMENSION "E" DOES NOT INCLUDE INTER-LEAD FLASH OR
PROTRUSIONS. INTER-LEAD FLASH AND PROTRUSIONS
SHALL NOT EXCEED 0.010 [0.25mm] PER SIDE.
4. LEAD THICKNESS AFTER PLATING TO BE 0.013 [0.33mm]
MAXIMUM.
SPECIFICATION: 98000-006
SUBJECT: PUBLISHED OUTLINE,
16 LEAD BATWING SOIC PKG.
PIN FUNCTION
1 GND
2 GND
3 NC
4 GND
5 GND
6 RF IN
7 NC
8 GND
9 GND
10 NC
11 NC
12 GND
13 GND
14 RF OUT
15 NC
16 GND
EXTERNAL TEST CIRCUIT
1000 pF 5.6 nH
RF IN
2.7 pF
1000 pF 5Ω RF OUT
3.9 µH
1.5 pF
VDD
0.1µf
A
4