CH1817ET 查看數據表（PDF） - Unspecified

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CH1817ET

Family of Low Profile DAA Modules

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Cermetek Microelectronics, Inc.

CH1817 Family of Low Profile DAA Modules

Figure 3. Telephone Line Interface.

1. RJ-11 Jacks must be provided by one of the

vendors on the list. Refer to Application Note

#130, Summary of Recommended Suppliers.

2. Current Line Device: F1 and F2 – 1.25amp.

A. UL 1459 must use a current limit device. A

Poly Fuse is recommended as this device

resets automatically after each power surge.

B. Resistors (10ohm carbon film or SMD 1/8W

minimum) may be used for non UL

applications.

3. Over Voltage and Lightning Protection.

A. DOC (Canada) may require external current

limiting devices. Use 1ohm resistors (carbon

film or SMD parts 1/8W minimum) in each lead

(TIP and RING). You may substitute fuses or

the Poly Fuse described in Section 2.

B. For lightning prone areas where there are

more than 2 storms per year, provide an earth

ground connection and use a three terminal

sidactor or similar device that provides metallic

and longitudinal protection. This must also

include the current protection in Section 2.

4. EMI/RFI Suppression.

The capacitor/ inductor network should be located

as close to the RJ-11 Jack as possible with an

excellent ground path to the chassis. Capacitors

C1 and C2 should not exceed 0.005µF. They

must have a rating of 1.5KV and typically have a

value of 0.001µF ± 20%. Inductors L1 and L2 are

ferrite cylinders and provide attenuation to high

frequencies from system level components

external to the CH1817. The required values must

be empirically determined for each product design

Figure 4. Low Power Ring Detection.

2002 Cermetek Microelectronics, Inc.

Page 5

Document No. 607-0007 Revision B (01/02)

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