TGA4953-EPU 查看數據表（PDF） - TriQuint Semiconductor

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TGA4953-EPU

9.9-11.2Gb/s Optical Modulator Driver

TriQuint Semiconductor 

Advance Product Datasheet

TGA4953EPU

Parameter

RθJC Thermal Resistance

(channel to backside of

carrier)

THERMAL INFORMATION

Test Condition

Vd2T=4.7V,

Id2T=150mA +/-5%

Pdiss

(W)

.71

TBase

(°C)

80

TCH

RθJC

MTTF

(°C) (°C/W) (HRS)

98

26

>1E6

Notes:

1. Based on a detailed thermal model of the output stage where channel temperature is highest.

Assumes worst case power dissipation condition (where no RF is applied at the input (no

power is dissipated in the load).

2. Thermal transfer is conducted thru the bottom of the TGA4953EPU package into the motherboard.

Design the motherboard to assure adequate thermal transfer to the base plate.

Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process

specifications. Specifications are subject to change without notice.

TriQuint Semiconductor Texas : (972)994 8465 Fax (972)994 8504 Web: www.triquint.com

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